The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
May. 12, 2005
Applicants:
Tzyy-jang Tseng, Hsinchu, TW;
Chih Ming Chang, Tainan, TW;
Cheng Po Yu, Jhongli, TW;
Chung W. Ho, Taipei, TW;
Inventors:
Tzyy-Jang Tseng, Hsinchu, TW;
Chih Ming Chang, Tainan, TW;
Cheng Po Yu, Jhongli, TW;
Chung W. Ho, Taipei, TW;
Assignee:
Unimicron Technology Corp., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
A substrate including a first patterned metallic layer, a second patterned metallic layer and an insulator is provided. One side of the first patterned metallic layer is connected to a corresponding side of the second patterned metallic layer. The first patterned metallic layer and the second patterned metallic layer are formed as a whole. The insulator fills the gaps in the first patterned metallic layer and the gaps in the second patterned metallic layer.