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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9137899 B1

PDFFull Text
Expired
Date of Patent:
Sep. 15, 2015

Filed:

Jan. 10, 2012

Process of electronic structure and electronic structure

Applicant:

Chung W. Ho, Taipei, TW;

Inventor:

Chung W. Ho, Taipei, TW;

Assignee:

Subtron Technology Co., Ltd., Hsinchu, TW;

Attorney:

Jianq Chyun IP Office

Primary Examiner:

Peter DungBa Vo

Assistant Examiner:

Azm Parvez

Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/18 (2006.01); H01L 21/683 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 21/6835 (2013.01); H05K 3/0097 (2013.01); H05K 3/4682 (2013.01); H01L 21/4857 (2013.01); H01L 24/25 (2013.01); H01L 24/82 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/82005 (2013.01); H05K 1/116 (2013.01); H05K 3/4602 (2013.01); H05K 2201/09718 (2013.01); H05K 2203/1469 (2013.01); H05K 2203/175 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49156 (2015.01); Y10T 29/49165 (2015.01);
Abstract

A process of electronic structure is provided. First, a carrier board is provided, in which the carrier board has a first surface. Next, a first release layer is formed on the first surface of the carrier board. The first release layer has property of withstanding high-temperature and temporary adhesion capability and the first release layer entirely or mostly overlays the first surface. Then, a built-up structure is formed on the first release layer. Finally, a separating process is performed so that the built-up structure is separated from the carrier board to form an electronic structure.

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Ho, Chung. (2015). Process of electronic structure and electronic structure (U.S. Patent No. 9137899). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9137899

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