The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 05, 2019

Filed:

Feb. 02, 2018
Applicant:

Chung W. Ho, Taipei, TW;

Inventor:

Chung W. Ho, Taipei, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/00 (2006.01); H05K 3/46 (2006.01); H05K 3/06 (2006.01); H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/00 (2006.01); H05K 1/09 (2006.01); H05K 3/32 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4682 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 1/188 (2013.01); H05K 3/0097 (2013.01); H05K 3/06 (2013.01); H05K 3/282 (2013.01); H05K 3/284 (2013.01); H05K 3/32 (2013.01); H05K 3/4007 (2013.01); H05K 3/4038 (2013.01); H05K 3/4652 (2013.01); H05K 3/4697 (2013.01); H05K 1/0224 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/09509 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/041 (2013.01); H05K 2203/1316 (2013.01);
Abstract

A circuit board including an electronic device and a manufacturing method of the circuit board are provided. The manufacturing method includes: providing a stainless steel base material including a first surface and a second surface opposite to each other, at least one first cavity located at the first surface and at least one second cavity located at the second surface; respectively forming a first and a second metal layers on the stainless steel base material; respectively disposing at least one first and at least one second electronic devices in the first and the second cavities; respectively forming a first and a second insulating layers on the first and the second surfaces; respectively forming a first and a second circuit structures on the first and the second insulating layers, separating the stainless steel base material, the first and the second metal layers to form two separate circuit substrates including electronic devices.


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