% Expired Patents = 46.2

Forward Citations = 226

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5 inventors (with patents filed for the assignee):

Chung W Ho (10 out of 22 patents)

Chung W Ho (3 out of 16 patents)

Ujwal Anant Deshpaude (1 out of 1 patent)

4. Chang-Ming Lin (1 out of 1 patent)

5. Anna Litza (1 out of 1 patent)

13 patents: Sort by Forward Citations

1. 6753600 - Structure of a substrate for a high density semiconductor package (2004-06-22),

2. 6586846 - Low cost decal material used for packaging (2003-07-01),

3. 6562656 - Cavity down flip chip BGA (2003-05-13),

4. 6455926 - High density cavity-up wire bond BGA (2002-09-24),

5. 6331447 - High density flip chip BGA (2001-12-18),

6. 6320256 - Quick turn around fabrication process for packaging substrates and high density cards (2001-11-20),

7. 6294477 - Low cost high density thin film processing (2001-09-25),

8. 6291268 - Low cost method of testing a cavity-up BGA substrate (2001-09-18),

9. 6287890 - Low cost decal material used for packaging (2001-09-11),

10. 6277672 - BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technology (2001-08-21),

11. 6242279 - High density wire bond BGA (2001-06-05),

12. 6221693 - High density flip chip BGA (2001-04-24),

13. 6197614 - Quick turn around fabrication process for packaging substrates and high density cards (2001-03-06),

Company Overview

Thin Film Module, Inc. is a technology company based in Hsinchu, Taiwan, specializing in the development and manufacturing of advanced thin film photovoltaic modules. The company focuses on innovative solar energy solutions, leveraging cutting-edge materials and processes to enhance energy efficiency and sustainability. With a commitment to research and development, Thin Film Module, Inc. aims to contribute to the global transition towards renewable energy sources, positioning itself as a key player in the solar technology landscape.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

13 Patents

#211 in Hsinchu

#1,169 in Taiwan

#45,081 in the World

Hsinchu, Taiwan

Thin Film Module, Inc.

Forward Citations = 226

5 inventors:

Chung W Ho (10 out of 22 patents)

Chung W Ho (3 out of 16 patents)

Ujwal Anant Deshpaude (1 out of 1 patent)

4. Chang-Ming Lin (1 out of 1 patent)

5. Anna Litza (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Thin Film Module, Inc.. Retrieved from https://idiyas.com/company/thin-film-module

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]