Enter assignee name

% Expired Patents = 46.2

Forward Citations = 226

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5 inventors (with patents filed for the assignee):

Chung W Ho (10 out of 22 patents)

Chung W Ho (3 out of 16 patents)

Ujwal Anant Deshpaude (1 out of 1 patent)

4. Chang-Ming Lin (1 out of 1 patent)

5. Anna Litza (1 out of 1 patent)

13 patents: Sort by Forward Citations

1. 6753600 - Structure of a substrate for a high density semiconductor package (2004-06-22),

2. 6586846 - Low cost decal material used for packaging (2003-07-01),

3. 6562656 - Cavity down flip chip BGA (2003-05-13),

4. 6455926 - High density cavity-up wire bond BGA (2002-09-24),

5. 6331447 - High density flip chip BGA (2001-12-18),

6. 6320256 - Quick turn around fabrication process for packaging substrates and high density cards (2001-11-20),

7. 6294477 - Low cost high density thin film processing (2001-09-25),

8. 6291268 - Low cost method of testing a cavity-up BGA substrate (2001-09-18),

9. 6287890 - Low cost decal material used for packaging (2001-09-11),

10. 6277672 - BGA package for high density cavity-up wire bond device connections using a metal panel, thin film and build up multilayer technology (2001-08-21),

11. 6242279 - High density wire bond BGA (2001-06-05),

12. 6221693 - High density flip chip BGA (2001-04-24),

13. 6197614 - Quick turn around fabrication process for packaging substrates and high density cards (2001-03-06),

Thin Film Module, Inc. is a leading provider of innovative thin film technology solutions for various industries. Our cutting-edge modules are designed to be lightweight, flexible, and highly efficient, making them ideal for a wide range of applications. With a focus on sustainability and performance, we are committed to delivering high-quality products that meet the evolving needs of our customers.

This text is generated by artificial intelligence and may not be accurate.