The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2002
Filed:
Jul. 09, 2001
Chung Wen Ho, Monte Sereno, CA (US);
Thin Film Module, Inc., Hsin Chu, TW;
Abstract
A method is provided for mounting high-density wire bond semiconductor devices. A layer of dielectric is deposited over the first surface of a metal panel. One or more thin film interconnect layers are then created on top of the dielectric layer. The BUM technology allows for the creation of a succession of layers over the thin film layers. The combined layers of thin film and BUM form the interconnect substrate. One or more cavities are created in the second surface of the metal panel; openings through the layer of dielectric are created where the layer of dielectric is exposed. One or more wire bond semiconductor die are inserted into the cavities, are die bonded and wire bonded to the openings that have been created in the layer of dielectric. Openings are created in the bottom BUM layer; solder balls are inserted and attached to this BUM layer for the completion of the Ball Grid Array (BGA) package.