This inventor holds 1 USPTO granted patent. Top assignee: Thin Film Module, Inc.. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Innovations in Thin Film Processing: The Work of Chang-Ming Lin
Introduction
Chang-Ming Lin, based in Fremont, CA, is an accomplished inventor with a notable contribution to the field of thin film processing. He holds a patent that presents a novel method aimed at improving the efficiency and cost-effectiveness of high-density thin film interconnect processing. His innovative approach has significant implications for the manufacturing industry, particularly in electronics.
Latest Patents
Chang-Ming Lin's patent titled "Low Cost High Density Thin Film Processing" introduces a new technique for creating interconnect lines on substrates. The process begins with the deposition of a thin layer of epoxy over a substrate surface, followed by the creation of a via pattern in the epoxy layer. The epoxy undergoes a swell and etch process, leading to the formation of a metal plating base using electroless seeding. The patent details subsequent steps, including the deposition of a photoresist layer, patterning and etching to form interconnect lines, and repeating the processing to enhance the structure. This innovative approach results in improved density and reduced costs for thin film technologies.
Career Highlights
Chang-Ming Lin's work is carried out at Thin Film Module, Inc., where he employs his expertise in thin film technology. His focus on developing innovative methods has positioned him as a valuable contributor to advancements in the industry. Over his career, he has demonstrated a commitment to enhancing electronic manufacturing processes, making significant strides in this field.
Collaborations
In his endeavors, Chang-Ming Lin collaborates with talented individuals such as Chung W. Ho and Ujwal Anant Deshpaude. Their combined expertise fosters an environment of innovation, leading to developments that push the boundaries of current technology.
Conclusion
Chang-Ming Lin's contributions to high-density thin film processing highlight the importance of innovation in the rapidly evolving electronics industry. His patent not only reflects his technical acumen but also signifies a commitment to improving manufacturing processes. As the industry continues to advance, inventors like Chang-Ming play a crucial role in shaping the future of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile