The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 24, 2001
Filed:
Jun. 14, 1999
Chung W. Ho, Monte Sereno, CA (US);
Thin Film Module, Inc., Hsin-Chu, TW;
Abstract
A new method is provided for mounting high-density flip chip BGA devices. A dielectric layer is first deposited over the first surface of a metal panel. One or more thin film interconnect layers are created on top of the dielectric layer. The interconnect layers are patterned in succession to create metal interconnect pattern. The BUM technology allows for the creation of a succession of layers over the thin film layers. The BUM layers can be used for power or ground distribution and for signal or fan-out interconnect. A cavity is etched on the second surface of the metal panel. A laser is used to create openings for flip chip pad contacts. The panel is subdivided into individual substrates. The method of the invention can also be applied to Land Grid Array and Pin Grid Array devices.