Hsinchu, Taiwan

Chih-Hsien Cheng

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignee: Subtron Technology Co., Ltd.. Active years: 2015-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Hsien Cheng. Retrieved from https://idiyas.com/inventor/chih-hsien-cheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 66.7

Average Co-Inventor Count = 1.6

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2015-2019

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3 patents (USPTO):Explore Patents

Title: The Innovative Journey of Chih-Hsien Cheng

Introduction:

Chih-Hsien Cheng, a pioneering inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents:

Chih-Hsien Cheng's latest patents focus on cutting-edge advancements in semiconductor technology, particularly in the development of next-generation microchips with enhanced performance and efficiency.

Career Highlights:

Throughout his illustrious career, Chih-Hsien Cheng has been at the forefront of innovation, holding key roles in leading tech companies where he spearheaded research and development projects that have shaped the industry.

Collaborations:

Chih-Hsien Cheng is known for his collaborative spirit, having worked closely with top researchers, engineers, and scientists from around the world to bring his visionary ideas to life. His partnerships have led to the creation of revolutionary technologies that have redefined the way we interact with electronics.

Conclusion:

In conclusion, Chih-Hsien Cheng stands as a trailblazing inventor whose relentless pursuit of innovation has left an indelible mark on the tech landscape. His passion for pushing the boundaries of what is possible continues to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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