Subtron Technology Co., Ltd.

Chih-Hsien Cheng

Shih-Hao Sun

Chin-Sheng Wang

Chung W Ho

A manufacturing method of a package carrier is provided. A substrate having a through hole is provided, wherein a profile of the through hole from top view is a first rounded rectangular. A heat conducting slug is disposed inside the through hole, wherein the heat conducting slug and an inner wall of the through hole are separated with a gap, and a profile of the heat conducting slug from top view is a second rounded rectangular. An insulating material is filled in the through hole so as to fix the heat conducting slug in the through hole. A conductive through hole structure, a first and a second patterned circuit layers are formed. The first and the second patterned circuit layers are respectively formed on two opposite sides of the substrate. The conductive through hole structure penetrates the substrate and connects portions of the first and the second patterned circuit layers.

Manufacturing method of package carrier

A manufacturing method including following steps is provided. A substrate that includes a core layer, a first conductive layer, and a second conductive layer is provided. A heat conducting channel is formed in the substrate, and an adhesion layer is formed on the second conductive layer to cover a side of the heat conducting channel. A heat conducting element and a buffer layer are placed into the heat conducting channel, and a gap is formed between either the heat conducting element or the buffer layer and an inner side surface of the heat conducting channel. The gap is filled with a first insulant material, and the adhesion layer and the buffer layer are removed to form a cavity and expose the heat conducting element. The first conductive layer and the second conductive layer are patterned to form a first patterned circuit layer and a second patterned circuit layer, respectively.

An edge separation equipment and an operating method thereof are suitable for a carrier and a circuit board in a coreless process. The carrier is attached to the circuit board by a mechanically separable interface, and the edge separation equipment is used to separate the edge of the carrier from the edge of the circuit board. The edge separation equipment includes a platform, a supporting device and a wind knife device. The platform has a supporting surface on which the carrier or the circuit board is mounted. The supporting device is configured at a side of the platform. The wind knife device is configured on the supporting device, and the air jet supplied by the wind knife device blows toward the edge of the carrier and the edge of the circuit board, such that there is an edge separation width between the carrier and the circuit board.

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Hsinchu County, Taiwan

Chih-Hsien Cheng