The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Jul. 13, 2017
Applicant:

Subtron Technology Co., Ltd., Hsinchu County, TW;

Inventors:

Yu-Chi Huang, Hsinchu County, TW;

Kuo-Tung Lin, Hsinchu County, TW;

Assignee:

Subtron Technology Co., Ltd., Hsinchu County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); B32B 2457/08 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H05K 3/3421 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/09072 (2013.01); H05K 2203/0156 (2013.01);
Abstract

A substrate structure including a carrier and a substrate is provided. The carrier includes a release layer, a dielectric layer and a metal layer. The dielectric layer is disposed between the release layer and the metal layer. The substrate includes a packaging region and a peripheral region. The peripheral region is connected to the packaging region and surrounds the packaging region. The peripheral region or the packaging region has a plurality of through holes. The substrate is disposed on the carrier. The release layer is located between the substrate and the dielectric layer. The release layer and the dielectric layer are filled in the through hole such that the substrate is separably attached to the carrier.


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