The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2026
Filed:
Oct. 13, 2023
Unimicron Technology Corp., Taoyuan City, TW;
John Hon-Shing Lau, Taoyuan City, TW;
Tzyy-Jang Tseng, Taoyuan City, TW;
Unimicron Technology Corp., Taoyuan City, TW;
Abstract
A chip package structure includes a first chip, a second chip, a plurality of first hybrid bonding pads, a first insulating layer, a first patterned conductive layer, a second patterned conductive layer, and a plurality of first conductive via structures and second conductive via structures. The first chip is electrically connected to the second chip through a plurality of first through silicon vias. The first chip is bonded onto the second chip through the first hybrid bonding pads. The first insulating layer covers the first and the second chips. The first and the second patterned conductive layers are respectively disposed on a first upper surface and a first lower surface of the first insulating layer. The first conductive via structures are electrically connected to the first and the second patterned conductive layers. The second conductive via structures are electrically connected to the first chip and the first patterned conductive layer.