John Hon-Shing Lau

Title: Innovations of John Hon-Shing Lau

Introduction

John Hon-Shing Lau is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of electronics and photonics, holding a total of 17 patents. His work focuses on advanced package structures and manufacturing methods that enhance the performance and efficiency of electronic devices.

Latest Patents

One of Lau's latest patents is titled "Package structure and manufacturing method thereof." This invention includes a package structure that comprises a circuit board, a package substrate, an electronic/photonic assembly, a film redistribution layer, a heat dissipation assembly, and an optical fiber assembly. The package substrate is positioned on the circuit board and is electrically connected to it. The electronic/photonic assembly consists of an ASIC assembly, an EIC assembly, and a PIC assembly. Notably, the EIC assembly and the PIC assembly are stacked on the package substrate and are electrically connected via the film redistribution layer. The heat dissipation assembly is strategically placed on the electronic/photonic assembly, while the optical fiber assembly is connected to the PIC assembly.

Another significant patent is "Circuit carrier and manufacturing method thereof and package structure." This invention features a circuit carrier that includes a substrate, a first build-up circuit structure, a second build-up circuit structure, a fine redistribution structure, and at least one conductive through hole. The substrate has a top surface and a bottom surface. The first build-up circuit structure is located on the top surface and is electrically connected to the substrate, while the second build-up circuit structure is on the bottom surface. The fine redistribution structure is attached to the first build-up circuit structure, with smaller line widths and spacings than the first structure. The conductive through hole connects the fine redistribution structure and the first build-up circuit structure.

Career Highlights

Throughout his career, John Hon-Shing Lau has worked with notable companies such as Unimicron Technology Corporation and the Industrial Technology Research Institute. His experience in these organizations has allowed him to develop and refine his innovative ideas in the field of electronics.

Collaborations

Lau has collaborated with esteemed colleagues, including Tzyy-Jang Tseng and Kai-Ming Yang. Their combined expertise has contributed to the advancement of technology in their respective fields.

Conclusion

John Hon-Shing Lau is a distinguished inventor whose work has significantly impacted the electronics and