The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Nov. 07, 2023
Unimicron Technology Corp., Taoyuan City, TW;
John Hon-Shing Lau, Taoyuan City, TW;
Tzyy-Jang Tseng, Taoyuan City, TW;
Unimicron Technology Corp., Taoyuan City, TW;
Abstract
A package structure includes a package substrate, an application specific integrated circuit (ASIC), a plurality of optoelectronic assemblies, and a plurality of organic interposers. The ASIC is disposed on the package substrate and electrically connected to the package substrate. The optoelectronic assemblies are separately disposed on the package substrate and surround the ASIC. Each of the plurality of optoelectronic assemblies includes an electronic integrated circuit (EIC), a photonic integrated circuit (PIC), and a plurality of hybrid bonding pads. The EIC is bonded to the PIC through the plurality of hybrid bonding pads. The plurality of organic interposers are separately disposed on the package substrate and surround the ASIC. The optoelectronic assemblies are electrically connected to the package substrate through the plurality of organic interposers.