The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Mar. 11, 2024
Unimicron Technology Corp., Taoyuan City, TW;
Wen-Hsien Lu, Taoyuan City, TW;
Yu-Ling Chuang, Taoyuan City, TW;
UNIMICRON TECHNOLOGY CORP., Taoyuan City, TW;
Abstract
A wiring board structure is provided, which includes a substrate, a first build-up circuit layer, and a second build-up circuit layer. The first build-up circuit layer is disposed on a first side of the substrate and has a first wiring area, and the first wiring area includes a first metal and a first dielectric. The second build-up circuit layer is disposed on a second side of the substrate and has a second wiring area, and the second wiring area includes a second metal, a second dielectric, and a third dielectric. The total volume of the second metal is less than the total volume of the first metal. The material of the third dielectric is different from the material of the second dielectric, and the ratio of the total volume of the third dielectric to the total volume of the second dielectric is between 0.45 and 0.55.