Wen-Hsien Lu

Title: Wen-Hsien Lu and His Wiring Board Invention.

Introduction

Wen-Hsien Lu is an inventor associated with Taoyuan, Taiwan, and Unimicron Technology Corporation. His patent work includes a wiring board structure designed with distinct build-up circuit layers on opposite sides of a substrate.

Latest Patents

Lu is credited with 1 patent, titled “Wiring Board Structure.” The invention describes a substrate with a first build-up circuit layer on one side and a second build-up circuit layer on the other. The first layer has a wiring area containing metal and dielectric materials. The second layer has a wiring area containing a second metal and two dielectric materials. Its design specifies that the second metal’s total volume is less than the first metal’s, that the two dielectric materials differ, and that the volume ratio of the third dielectric to the second dielectric falls between 0.45 and 0.55.

Career Highlights

Lu’s listed patent reflects work on wiring board construction and the arrangement of conductive and insulating materials. He is associated with Unimicron Technology Corporation, a company connected to the electronics and circuit-board industry.

Collaborations

Lu’s listed coworker is Yu-Ling Chuang, who is a woman. The available information identifies her as a coworker but does not specify a particular joint patent or collaboration.

Conclusion

Wen-Hsien Lu’s patent documents a wiring board design that balances metal and dielectric volumes across two build-up circuit layers, highlighting his contribution to circuit-board technology.