This inventor holds 164 USPTO granted patents and 32 published patent applications and 2 EPO patents, primarily in Semiconductor Packaging (CPC class H01L23-49822). Top assignees: Phoenix Precision Technology Corporation, Phoenix Pioneer Technology Co., Ltd., Unimicron Technology Corporation. Active years: 2002-2025.
Inventors with similar research interests:
Location History:
- Taoyuan County, TW (2008 - 2009)
- Taiwan, CN (2011)
- TaoYuan, TW (2002 - 2017)
- Hsin-chu, TW (2006 - 2017)
- Hukou Township, TW (2016 - 2018)
- Hsinchu County, TW (2015 - 2024)
Company Filing History:
57 out of 95 
55 out of 76 
34 out of 520 
Years Active: 2002-2025
Areas of Expertise:
Shih-Ping Hsu: Innovating the Future of Semiconductor Packaging
Introduction:
In the world of technological advancements, the name Shih-Ping Hsu stands tall as an industry expert in semiconductor packaging and manufacturing. With a vast portfolio of 160 patents, Hsu has made significant contributions to the field. Based in Hsin-Chu, Taiwan, Hsu's expertise and inventions have revolutionized the industry, particularly in surface acoustic wave filter package structures and semiconductor package devices.
Latest Patents:
Hsu's latest patents showcase his innovative thinking and commitment to pushing the boundaries of semiconductor packaging techniques. One of his notable inventions is the "Manufacturing method for surface acoustic wave filter package structure." This patent reveals a novel approach to creating a surface acoustic wave (SAW) filter package structure using a dielectric substrate with intricate conductive layers. This innovative design improves the performance and durability of surface acoustic wave filters, making them more efficient and reliable.
Another recent patent by Hsu is the "Semiconductor package device," which introduces a flexible carrier with a unique construction. The device incorporates both flexible and rigid layers, allowing for improved customization and versatility in chip connections. Combined with specially designed molding layers and adhesive materials, this semiconductor package device provides enhanced protection and stability for individual chips, ensuring optimal performance and longevity.
Career Highlights:
Throughout his illustrious career, Shih-Ping Hsu has showcased an unparalleled commitment to innovation and research in the field of semiconductor packaging. He has held key positions in prominent companies like Phoenix Precision Technology Corporation and Phoenix Pioneer Technology Co., Ltd. These well-established organizations have provided a platform for Hsu to apply his expertise and bring cutting-edge solutions to the semiconductor industry.
Collaborations:
Hsu's success is not limited to his individual achievements alone, as he has collaborated with esteemed professionals in his field. Notable colleagues include Che-Wei Hsu and Chu-Chin Hu, who have worked closely with Hsu to leverage their combined knowledge and experience. These collaborations have undoubtedly led to groundbreaking discoveries and advancements in the semiconductor packaging domain.
Conclusion:
Shih-Ping Hsu's remarkable career and vast patent portfolio in semiconductor packaging underscore his position as a trailblazer in the industry. His inventions, such as the surface acoustic wave filter package structure and the semiconductor package device, have revolutionized the field and opened new avenues for technological advancements. Through his collaborations and career highlights, Hsu continues to shape the future of semiconductor packaging with his innovative thinking and ingenuity. As the industry evolves, we can expect to see more groundbreaking contributions from this visionary innovator.
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