The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Feb. 24, 2022
Applicant:
Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;
Inventors:
Shih-Ping Hsu, Hsinchu County, TW;
Chu-Chin Hu, Hsinchu County, TW;
Pao-Hung Chou, Hsinchu County, TW;
Assignee:
PHOENIX PIONEER TECHNOLOGY CO., LTD., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H05K 1/0271 (2013.01); H05K 1/116 (2013.01); H05K 3/424 (2013.01); H05K 3/429 (2013.01); H05K 3/4682 (2013.01); H01L 21/563 (2013.01); H01L 24/16 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/3511 (2013.01);
Abstract
An intermediate substrate is provided with a plurality of conductive posts and support members arranged at opposite sides of a coreless circuit structure and insulating layers encapsulating the conductive posts and the support members. Through the arrangement of the support members and the insulating layers, the intermediate substrate can meet the rigidity requirement so as to effectively resist warping and achieve an application of fine-pitch circuits.