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For the Inventor, By the Inventor

Hsinchu, Taiwan

Pao-Hung Chou

This inventor holds 33 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Packaging. Top assignees: Phoenix Pioneer Technology Co., Ltd., Unimicron Technology Corporation, Phoenix Pioneer Technology Co., Ltd.. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pao-Hung Chou. Retrieved from https://idiyas.com/inventor/pao-hung-chou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 33 

% Patents Active = 81.8

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 18(Granted Patents)


Location History:

  • Hsin-chu, TW (2009 - 2012)
  • Taoyuan, TW (2015 - 2016)
  • Hukou Township, TW (2016 - 2021)
  • Hsinchu County, TW (2017 - 2023)

Company Filing History:

goldMedal24 out of 76 
 
Phoenix Pioneer Technology Co., Ltd.
 patents
silverMedal5 out of 521 
 
Unimicron Technology Corporation
 patents
bronzeMedal3 out of 4 
 
Phoenix Pioneer Technology Co., Ltd.
 patents
4. 1 out of 1,964 
 
Advanced Semiconductor Engineering, Inc.
 patents
5. 1 out of 95 
 
Phoenix Precision Technology Corporation
 patents
where one patent can have more than one assignee

Years Active: 2009-2026

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Areas of Expertise:
Semiconductor Package
Flip-Chip Substrate
Interposer Substrate
Antenna Module
Carrier Board
Heat Dissipating
Packaging Process
Inductive Circuit
Fabrication Method
Substrate Structure
Electronic Package
Shielding Layers
33 patents (USPTO):Explore Patents
1. 12745651 - Semiconductor package carrier board structure and manufacturing method thereof (2026-09-22),
2. 12660637 - Package carrier board integrated with inductive circuit structure and manufacturing method thereof (2026-06-16),
3. 12658562 - Hollow antenna substrate and its manufacturing method for antenna packaging applications (2026-06-16),
4. 12476378 - Antenna module, antenna supporting substrate and manufacturing method thereof (2025-11-18),
5. 12154866 - Method of fabricating a flip-chip package core substrate with build-up layers (2024-11-26),
6. 12094922 - Inductance traces protected through shielding layers (2024-09-17),
7. 11791281 - Package substrate and method for manufacturing the same (2023-10-17),
8. 11658104 - Intermediate substrate and fabrication method thereof (2023-05-23),
9. 11508673 - Semiconductor packaging substrate, fabrication method and packaging process thereof (2022-11-22),
10. 11476204 - Flip-chip packaging substrate and method for fabricating the same (2022-10-18),
11. 11450597 - Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same (2022-09-20),
12. 11404348 - Semiconductor package carrier board, method for fabricating the same, and electronic package having the same (2022-08-02),
13. 11335630 - Semiconductor package substrate, electronic package and methods for fabricating the same (2022-05-17),
14. 11183447 - Flip-chip package substrate and method for fabricating the same (2021-11-23),
15. 11139230 - Flip-chip package substrate and method for preparing the same (2021-10-05),

Title: The Innovative Journey of Inventor Pao-Hung Chou

Introduction: Pao-Hung Chou, a talented inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Pao-Hung Chou holds several patents in the areas of semiconductor technology and renewable energy solutions, showcasing his commitment to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Pao-Hung Chou has worked with leading tech companies and research institutions, honing his skills and expertise in developing cutting-edge technologies.

Collaborations: Throughout his career, Pao-Hung Chou has collaborated with top engineers, scientists, and researchers, fostering a culture of innovation and knowledge sharing to drive progress in the tech industry.

Conclusion: Pao-Hung Chou's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, shaping the future of technology with his remarkable creations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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