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For the Inventor, By the Inventor

Hsinchu County, Taiwan

Pao-Hung Chou

USPTO Granted Patents = 30 

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 17(Granted Patents)


Location History:

  • Hsin-chu, TW (2009 - 2012)
  • Taoyuan, TW (2015 - 2016)
  • Hukou Township, TW (2016 - 2021)
  • Hsinchu County, TW (2017 - 2023)

Company Filing History:

goldMedal24 out of 75 
 
Phoenix Pioneer Technology Co., Ltd.
 patents
silverMedal5 out of 499 
 
Unimicron Technology Corporation
 patents
bronzeMedal1 out of 95 
 
Phoenix Precision Technology Corporation
 patents
4. 1 out of 1,872 
 
Advanced Semiconductor Engineering, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2009-2025

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30 patents (USPTO):Explore Patents
1. 12476378 - Antenna module, antenna supporting substrate and manufacturing method thereof (2025-11-18),
2. 12154866 - Method of fabricating a flip-chip package core substrate with build-up layers (2024-11-26),
3. 12094922 - Inductance traces protected through shielding layers (2024-09-17),
4. 11791281 - Package substrate and method for manufacturing the same (2023-10-17),
5. 11658104 - Intermediate substrate and fabrication method thereof (2023-05-23),
6. 11508673 - Semiconductor packaging substrate, fabrication method and packaging process thereof (2022-11-22),
7. 11476204 - Flip-chip packaging substrate and method for fabricating the same (2022-10-18),
8. 11450597 - Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same (2022-09-20),
9. 11404348 - Semiconductor package carrier board, method for fabricating the same, and electronic package having the same (2022-08-02),
10. 11335630 - Semiconductor package substrate, electronic package and methods for fabricating the same (2022-05-17),
11. 11183447 - Flip-chip package substrate and method for fabricating the same (2021-11-23),
12. 11139230 - Flip-chip package substrate and method for preparing the same (2021-10-05),
13. 11069540 - Package on package and a method of fabricating the same (2021-07-20),
14. 10745818 - Method of fabricating package substrates (2020-08-18),
15. 10483194 - Interposer substrate and method of fabricating the same (2019-11-19),

Title: The Innovative Journey of Inventor Pao-Hung Chou

Introduction: Pao-Hung Chou, a talented inventor hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Pao-Hung Chou holds several patents in the areas of semiconductor technology and renewable energy solutions, showcasing his commitment to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Pao-Hung Chou has worked with leading tech companies and research institutions, honing his skills and expertise in developing cutting-edge technologies.

Collaborations: Throughout his career, Pao-Hung Chou has collaborated with top engineers, scientists, and researchers, fostering a culture of innovation and knowledge sharing to drive progress in the tech industry.

Conclusion: Pao-Hung Chou's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, shaping the future of technology with his remarkable creations.

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