The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2026
Filed:
Aug. 15, 2023
Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;
Pao-Hung Chou, Hsinchu County, TW;
Ming-Yeh Chang, Hsinchu County, TW;
PHOENIX PIONEER TECHNOLOGY CO., LTD., Hsinchu County, TW;
Abstract
A semiconductor package carrier board structure includes a plurality of carrier board bodies and a plurality of supporting bumps. The carrier board body includes a build-up circuit structure and a plurality of conductive blocks bonded to the build-up circuit structure. Adjacent ones of the carrier board bodies are connected to each other with their corresponding conductive blocks. An area formed by the adjacent conductive blocks defines a cutting path. An opening is formed on a surface of each of the conductive blocks at the cutting path. The supporting bumps are erected between the adjacent openings. As such, each of the supporting bumps corresponds to a position overlapping the cutting path to provide the support function of the semiconductor package carrier board structure when performing the semiconductor packaging operation. After performing the singulation operation, the supporting bumps can be completely removed and one side of the openings can be exposed.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile