The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 05, 2021
Filed:
Aug. 16, 2019
Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;
Pao-Hung Chou, Hsinchu County, TW;
Chun-Hsien Yu, Hsinchu County, TW;
Shih-Ping Hsu, Hsinchu County, TW;
PHOENIX PIONEER TECHNOLOGY CO., LTD., Hsinchu County, TW;
Abstract
A flip-chip package substrate and a method for preparing the same in accordance with the present disclosure includes stacking a reinforcement layer on two opposing sides of a middle layer in order to increase the rigidity of the flip-chip package substrate, and promoting a thin middle layer, wherein the sizes of the end faces of conductive portions can be minimized according to needs. This increases the number of electrical contacts possible in a unit area and enables the creation of finer line pitch and higher layout density of the circuit portions, thereby satisfying the need for packaging of high integration/large scale chips while preventing warpage from occurring in the electronic packages.