For the Inventor, By the Inventor

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Hsinchu County, Taiwan

Phoenix Pioneer Technology Co., Ltd.

USPTO Granted Patents = 75

EPO Patents = 2

Trademarks = 6

Forward Citations = 51

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25 inventors (with patents filed for the assignee):

Shih-Ping Hsu (55 out of 164 patents)

Che-Wei Hsu (28 out of 35 patents)

Pao-Hung Chou (24 out of 30 patents)

4. Chun-Hsien Yu (20 out of 20 patents)

5. Chu-Chin Hu (10 out of 22 patents)

6. Chin-Ming Liu (4 out of 5 patents)

7. Hsien-Ming Tsai (4 out of 4 patents)

8. Chao-Tsung Tseng (4 out of 4 patents)

9. Chih-Kuai Yang (3 out of 6 patents)

10. Tung-Yao Kuo (3 out of 3 patents)

11. Chao-Chung Tseng (3 out of 3 patents)

12. E-Tung Chou (3 out of 8 patents)

13. Chin-Wen Liu (2 out of 2 patents)

14. Tang-I Wu (2 out of 2 patents)

15. Shu-Wei Hu (2 out of 2 patents)

Core Competencies:

Antenna Module

Semiconductor Packaging

Flip-Chip Package

Electronic Package

Inductor Structure

Surface Acoustic Wave Filter

Smart Card Fingerprint Module

Interposer Substrate

EMI Shielding

Package Substrate

Manufacturing Methods

Energy Conversion Module

75 patents: Sort by Forward Citations

1. 12476378 - Antenna module, antenna supporting substrate and manufacturing method thereof (2025-11-18),

2. 12347919 - Semiconductor package antenna structure and its manufacturing method (2025-07-01),

3. 12293976 - Semiconductor EMI shielding component, semiconductor package structure and manufacturing method thereof (2025-05-06),

4. 12272653 - Semiconductor packaging substrate and manufacturing method thereof (2025-04-08),

5. 12154866 - Method of fabricating a flip-chip package core substrate with build-up layers (2024-11-26),

6. 12100665 - Semiconductor package structure and manufacturing method thereof (2024-09-24),

7. 12094922 - Inductance traces protected through shielding layers (2024-09-17),

8. 12080670 - Manufacturing method of semiconductor package structure (2024-09-03),

9. 12080466 - Electronic package (2024-09-03),

10. 12062685 - Inductor structure having conductive sheets having fan plate shape arranged in ring structure and fabrication method thereof, electronic package and fabrication method thereof, and method for fabricating packaging carrier (2024-08-13),

11. 11798909 - Semiconductor package structure and manufacturing method thereof (2023-10-24),

12. 11791281 - Package substrate and method for manufacturing the same (2023-10-17),

13. 11757426 - Manufacturing method for surface acoustic wave filter package structure (2023-09-12),

14. 11749612 - Semiconductor package device (2023-09-05),

15. 11658104 - Intermediate substrate and fabrication method thereof (2023-05-23),

Phoenix Pioneer Technology Co., Ltd. is a leading technology company specializing in innovative solutions for various industries. With a strong focus on research and development, we provide cutting-edge products and services to our global clientele. Our expertise lies in the areas of software development, hardware design, and system integration. By leveraging advanced technologies, we deliver efficient and reliable solutions that empower businesses and drive success. Visit our website to learn more about our comprehensive range of products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

75 Patents

#6 in Hsinchu County

#290 in Taiwan

#9,734 in the World

Hsinchu County, Taiwan

Phoenix Pioneer Technology Co., Ltd.

Forward Citations = 51

25 inventors:

Shih-Ping Hsu (55 out of 164 patents)

Che-Wei Hsu (28 out of 35 patents)

Pao-Hung Chou (24 out of 30 patents)

4. Chun-Hsien Yu (20 out of 20 patents)

5. Chu-Chin Hu (10 out of 22 patents)

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