logo

For the Inventor, By the Inventor

Hsinchu, Taiwan

Chu-Chin Hu

This inventor holds 23 USPTO granted patents and 10 published patent applications and 1 EPO patent, primarily in Packaging Technology. Top assignees: Phoenix Pioneer Technology Co., Ltd., Phoenix Precision Technology Corporation, Phoenix LLC. Active years: 2003-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chu-Chin Hu. Retrieved from https://idiyas.com/inventor/chu-chin-hu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 78.3


Average Co-Inventor Count = 2.0

ph-index = 4

Forward Citations = 139(Granted Patents)


Location History:

  • Hsinchu, TW (2003 - 2013)
  • Taoyuan, TW (2012 - 2016)
  • Hsinchu County, TW (2017 - 2023)

Company Filing History:

goldMedal10 out of 76 
 
Phoenix Pioneer Technology Co., Ltd.
 patents
silverMedal5 out of 95 
 
Phoenix Precision Technology Corporation
 patents
bronzeMedal3 out of 30 
 
Phoenix LLC
 patents
4. 3 out of 522 
 
Unimicron Technology Corporation
 patents
5. 1 out of 5 
 
Phoenix Pioneer Technology Co., Ltd.
 patents
6. 1 out of 106 
 
Zhen Ding Technology Co., Ltd.
 patents

Years Active: 2003-2026

Loading Chart...
Loading Chart...
Areas of Expertise:
Component-Embedded Packaging
Flip-Chip Package
Electronic Package
Fabrication Method
Packaging Substrate
Thermal Management
Conductive Structure
Multi-Chip Semiconductor
Integrated Library Core
Pre-Soldering Material
Carrier Board Structure
IC Package Substrate
23 patents (USPTO):Explore Patents
1. 12610838 - Component-embedded packaging structure (2026-04-21),
2. 11658104 - Intermediate substrate and fabrication method thereof (2023-05-23),
3. 11488911 - Flip-chip package substrate (2022-11-01),
4. 11031329 - Method of fabricating packaging substrate (2021-06-08),
5. 10784205 - Electronic package (2020-09-22),
6. 10580739 - Package substrate and associated fabrication method with varying depths for circuit device terminals (2020-03-03),
7. 10204865 - Electronic package and conductive structure thereof (2019-02-12),
8. 10079220 - Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding (2018-09-18),
9. 10002823 - Packaging substrate and method of fabricating the same (2018-06-19),
10. 9831217 - Method of fabricating package substrates (2017-11-28),
11. 9754982 - Packaging module and substrate structure thereof (2017-09-05),
12. 9613894 - Electronic package (2017-04-04),
13. 9601402 - Package apparatus and manufacturing method thereof (2017-03-21),
14. 9589935 - Package apparatus and manufacturing method thereof (2017-03-07),
15. 9357647 - Packaging substrate, method for manufacturing same, and chip packaging body having same (2016-05-31),

Title: The Innovative Journey of Inventor Chu-Chin Hu

Introduction: Inventor Chu-Chin Hu, a distinguished male innovator hailing from Hsinchu County, Taiwan, has made significant contributions to the field of technology and patents.

Latest Patents: Chu-Chin Hu's latest patents showcase his expertise in cutting-edge technologies, including advancements in semiconductor devices, renewable energy solutions, and artificial intelligence systems.

Career Highlights: Throughout his illustrious career, Chu-Chin Hu has been at the forefront of innovation, holding numerous patents in various industries such as electronics, telecommunications, and biotechnology. His groundbreaking inventions have revolutionized the way we interact with technology on a daily basis.

Collaborations: Chu-Chin Hu has collaborated with leading research institutions, universities, and multinational corporations to further develop his inventions and bring them to the market. His collaborative efforts have resulted in groundbreaking technologies that have had a lasting impact on society.

Conclusion: Inventor Chu-Chin Hu's relentless pursuit of innovation and his passion for creating cutting-edge technologies have solidified his reputation as a visionary in the world of patents and inventions. His contributions continue to inspire future generations of inventors and shape the landscape of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…