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Taoyuan, Taiwan

Zhen Ding Technology Co., Ltd.

USPTO Granted Patents = 106

Trademarks = 1

Forward Citations = 113

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99 inventors (with patents filed for the assignee):

Cheng-Hsien Lin (15 out of 43 patents)

Shou-Jui Hsiang (14 out of 15 patents)

Ming-Jaan Ho (10 out of 64 patents)

4. Shih-Ping Hsu (9 out of 164 patents)

5. Szu-Hsiang Su (8 out of 8 patents)

6. Chien-Pang Cheng (8 out of 8 patents)

7. Mao-Feng Hsu (7 out of 12 patents)

8. Hung-Yi Chang (7 out of 9 patents)

9. Xian-Qin Hu (5 out of 39 patents)

10. Yu-Cheng Huang (5 out of 14 patents)

11. Wei-Shuo Su (5 out of 5 patents)

12. E-Tung Chou (5 out of 8 patents)

13. Yao-Wen Bai (5 out of 10 patents)

14. Chih-Yi Tu (5 out of 8 patents)

15. Shing-Tza Liou (5 out of 9 patents)

Core Competencies:

Block Copolymer

Self-Healing Composition

Electromagnetic Shielding Film

Polyimide Mixture

Conductive Composite Fabric

Low Dielectric Resin

Photosensitive Resin Composition

Flexible Circuit Board

Printed Circuit Board

Package Structure

Interposer Technology

Multilayer Circuit Board

106 patents: Sort by Forward Citations

1. 11859038 - Method for manufacturing a block copolymer of polyamide acid (2024-01-02),

2. 11713334 - Method for manufacturing self-healing composition, self-healing composition, and self-healing film (2023-08-01),

3. 11680138 - Polymer dispersion, method for manufacturing the polymer dispersion, and method for manufacturing polymer composite film (2023-06-20),

4. 11672108 - Method for manufacturing electromagnetic shielding film (2023-06-06),

5. 11655366 - Transparent polyimide mixture, method for manufacturing the transparent polyimide mixture, and method for manufacturing transparent polyimide film (2023-05-23),

6. 11602921 - Elastic conductive composite fabric capable of detecting and providing electrical signals according to reflections of limbs and body movements (2023-03-14),

7. 11524491 - Method for manufacturing thick polyimide film (2022-12-13),

8. 11261328 - Circuit board using low dielectric resin composition (2022-03-01),

9. 10928730 - Photosensitive resin composition, and polymer film made therefrom (2021-02-23),

10. 10894882 - Low dielectric resin composition, film and circuit board using the same (2021-01-19),

11. 10875984 - Inorganic shell, resin composition, and method for making inorganic shell (2020-12-29),

12. 10844174 - Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same (2020-11-24),

13. 10822522 - Modified polyimide compound, resin composition and polyimide film (2020-11-03),

14. 10428238 - Resin composition, polyimide film and method for manufacturing polyimide film (2019-10-01),

15. 10423069 - Water soluble photosensitive resin composition and film using same (2019-09-24),

Zhen Ding Technology Co., Ltd. is a leading global provider of electronic manufacturing services for various industries. With over 30 years of experience, Zhen Ding Technology offers a wide range of solutions including printed circuit board assembly, flexible printed circuit manufacturing, and system assembly. The company is committed to delivering high-quality products and services to meet the evolving needs of its customers. Visit their website to learn more about their offerings and capabilities.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

106 Patents

#21 in Taoyuan

#214 in Taiwan

#7,191 in the World

Taoyuan, Taiwan

Zhen Ding Technology Co., Ltd.

Forward Citations = 113

99 inventors:

Cheng-Hsien Lin (15 out of 43 patents)

Shou-Jui Hsiang (14 out of 15 patents)

Ming-Jaan Ho (10 out of 64 patents)

4. Shih-Ping Hsu (9 out of 164 patents)

5. Szu-Hsiang Su (8 out of 8 patents)

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