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Taoyuan, Taiwan

Zhen Ding Technology Co., Ltd.

USPTO Granted Patents = 106

% Expired Patents = 34.9

Trademarks = 1

Forward Citations = 117

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99 inventors (with patents filed for the assignee):

Cheng-Hsien Lin (15 out of 43 patents)

Shou-Jui Hsiang (14 out of 15 patents)

Ming-Jaan Ho (10 out of 68 patents)

4. Shih-Ping Hsu (9 out of 164 patents)

5. Szu-Hsiang Su (8 out of 8 patents)

6. Chien-Pang Cheng (8 out of 8 patents)

7. Mao-Feng Hsu (7 out of 12 patents)

8. Hung-Yi Chang (7 out of 9 patents)

9. Xian-Qin Hu (5 out of 39 patents)

10. Yu-Cheng Huang (5 out of 14 patents)

11. Wei-Shuo Su (5 out of 5 patents)

12. E-Tung Chou (5 out of 8 patents)

13. Yao-Wen Bai (5 out of 10 patents)

14. Chih-Yi Tu (5 out of 8 patents)

15. Shing-Tza Liou (5 out of 9 patents)

Core Competencies:

Polyimide Film

Flexible Circuit Board

Packaging Substrate

Resin Composition

Electromagnetic Shielding

Multilayer Circuit Board

Self-Healing Composition

Conductive Fabric

Photosensitive Resin

Chip Packaging

Coreless Package

Heat Sink

106 patents: Sort by Forward Citations

1. 11859038 - Method for manufacturing a block copolymer of polyamide acid (2024-01-02),

2. 11713334 - Method for manufacturing self-healing composition, self-healing composition, and self-healing film (2023-08-01),

3. 11680138 - Polymer dispersion, method for manufacturing the polymer dispersion, and method for manufacturing polymer composite film (2023-06-20),

4. 11672108 - Method for manufacturing electromagnetic shielding film (2023-06-06),

5. 11655366 - Transparent polyimide mixture, method for manufacturing the transparent polyimide mixture, and method for manufacturing transparent polyimide film (2023-05-23),

6. 11602921 - Elastic conductive composite fabric capable of detecting and providing electrical signals according to reflections of limbs and body movements (2023-03-14),

7. 11524491 - Method for manufacturing thick polyimide film (2022-12-13),

8. 11261328 - Circuit board using low dielectric resin composition (2022-03-01),

9. 10928730 - Photosensitive resin composition, and polymer film made therefrom (2021-02-23),

10. 10894882 - Low dielectric resin composition, film and circuit board using the same (2021-01-19),

11. 10875984 - Inorganic shell, resin composition, and method for making inorganic shell (2020-12-29),

12. 10844174 - Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same (2020-11-24),

13. 10822522 - Modified polyimide compound, resin composition and polyimide film (2020-11-03),

14. 10428238 - Resin composition, polyimide film and method for manufacturing polyimide film (2019-10-01),

15. 10423069 - Water soluble photosensitive resin composition and film using same (2019-09-24),

Company Overview

Zhen Ding Technology Co., Ltd., headquartered in Taoyuan, Taiwan, specializes in the development and manufacturing of advanced printed circuit boards (PCBs). The company focuses on innovative technologies including polyimide film, flexible circuit boards, and multilayer circuit boards, catering to diverse applications in electronics. Zhen Ding is also engaged in research on packaging substrates, resin compositions, and electromagnetic shielding, positioning itself as a leader in the evolving landscape of electronic components and materials.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

106 Patents

#23 in Taoyuan

#223 in Taiwan

#7,405 in the World

Taoyuan, Taiwan

Zhen Ding Technology Co., Ltd.

Forward Citations = 117

99 inventors:

Cheng-Hsien Lin (15 out of 43 patents)

Shou-Jui Hsiang (14 out of 15 patents)

Ming-Jaan Ho (10 out of 68 patents)

4. Shih-Ping Hsu (9 out of 164 patents)

5. Szu-Hsiang Su (8 out of 8 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Zhen Ding Technology Co., Ltd.. Retrieved from https://idiyas.com/company/zhen-ding-technology-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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