Shenzhen, China

Xian-Qin Hu

USPTO Granted Patents = 39 

Average Co-Inventor Count = 3.0

ph-index = 3

Forward Citations = 36(Granted Patents)


Location History:

  • Guangdong, CN (2018 - 2019)
  • Hebei, CN (2020)
  • Qinhuangdao, CN (2017 - 2022)
  • Shenzhen, CN (2015 - 2024)

Company Filing History:


Years Active: 2015-2024

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39 patents (USPTO):

Xian-Qin Hu: Innovations in Circuit Board Technology

Introduction

Xian-Qin Hu, an accomplished inventor located in Shenzhen, China, has made significant contributions to the field of circuit board technology. With a remarkable portfolio of 39 patents, he has demonstrated a consistent ability to innovate and refine methods for manufacturing advanced electronic components.

Latest Patents

Hu's latest patents reflect his commitment to enhancing circuit board design and functionality. One of his most significant inventions is the patent for a "Circuit board and method for manufacturing the same." This patent outlines a method for fabricating circuit boards featuring narrow conductive traces and reduced spaces between these traces. Specifically, it involves a base layer and two first wiring layers located on opposite surfaces of the base layer. The first wiring layers include a first bottom wiring that forms part of a complex structure designed for improved electronic performance.

Another noteworthy invention is the patent for a "Circuit board with heat dissipation structure and method for manufacturing same." This invention details a method that involves a wiring base board which consists of a first conductor layer, an insulation layer, and an alloy layer that are sequentially stacked. Notably, this design integrates a thermal conductive surface, significantly enhancing the heat dissipation capabilities of circuit boards, thereby ensuring their efficiency in high-performance applications.

Career Highlights

Throughout his career, Xian-Qin Hu has worked with prominent companies in the electronics sector. Notably, he was associated with Avary Holding (Shenzhen) Co., Limited, and Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. His experience in these organizations has enabled him to refine his expertise in circuit board technology, paving the way for his innovative patent applications.

Collaborations

In the realm of collaboration, Hu has worked alongside esteemed colleagues including Ming-Jaan Ho and Fu-Yun Shen. Their combined efforts have likely contributed to their mutual successes in developing cutting-edge circuit board technologies and solutions.

Conclusion

Xian-Qin Hu continues to be a pivotal figure in advancing circuit board innovations. His extensive patent portfolio and substantial career highlights illustrate his dedication to improving electronic component design and manufacturing methods. As technology evolves, Hu's contributions will undoubtedly play a vital role in shaping the future of circuit board applications.

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