The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 30, 2023

Filed:

Nov. 16, 2021
Applicants:

Qing Ding Precision Electronics (Huaian) Co.,ltd, Huai an, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Ming-Jaan Ho, New Taipei, TW;

Xian-Qin Hu, Shenzhen, CN;

Fu-Yun Shen, Shenzhen, CN;

Hsiao-Ting Hsu, New Taipei, TW;

Yong-Chao Wei, Qinhuangdao, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/04 (2006.01); H05K 3/46 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H05K 1/111 (2013.01); H05K 3/04 (2013.01); H05K 3/107 (2013.01); H05K 3/4614 (2013.01); H05K 2201/0394 (2013.01); H05K 2201/09563 (2013.01);
Abstract

A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.


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