The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2020

Filed:

Apr. 23, 2019
Applicants:

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Hongqisheng Precision Electronics (Qinhuangdao) Co.,ltd., Qinhuangdao, CN;

Inventors:

Xian-Qin Hu, Shenzhen, CN;

Ming-Jaan Ho, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01); H05K 3/22 (2006.01); H05K 3/24 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0281 (2013.01); H05K 1/112 (2013.01); H05K 1/118 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H05K 1/189 (2013.01); H05K 3/22 (2013.01); H05K 3/4007 (2013.01); H05K 3/4038 (2013.01); H05K 1/115 (2013.01); H05K 1/116 (2013.01); H05K 3/244 (2013.01); H05K 3/428 (2013.01); H05K 2201/041 (2013.01); H05K 2201/097 (2013.01); H05K 2201/09054 (2013.01); H05K 2201/09454 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09709 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/10689 (2013.01); H05K 2201/2009 (2013.01); Y10T 29/49165 (2015.01);
Abstract

A method for manufacturing a flexible printed circuit board, comprising: providing a flexible printed circuit substrate; defining first through holes and second through holes through the flexible printed circuit substrate; and forming first conductive pillars and second conductive pillars; and defining first grooves by removing a portion of each first conductive pillar and defining second grooves by removing a portion of each second conductive pillar; the first grooves and the second grooves are defined from an outer surface of the flexible printed circuit board on the second conductive pattern layer side to a surface of the second conductive pattern layer away from the first conductive pattern layer; each of the first grooves is aligned with and corresponds to one first conductive pillar, and each of the second grooves is aligned with and corresponds to one second conductive pillar.


Find Patent Forward Citations

Hu, Xian-Qin. (2020). Method for manufacturing flexible printed circuit board (U.S. Patent No. 10791625). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10791625

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…