The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2020
Filed:
Dec. 06, 2019
Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Jian-Yi Hao, Shenzhen, CN;
Yan-Lu Li, Shenzhen, CN;
Xian-Qin Hu, Shenzhen, CN;
Ming-Hua Du, Qinhuangdao, CN;
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Qinhuangdao, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Abstract
A method for manufacturing a waterproof circuit board comprises steps of providing a first wiring substrate suitable for high-frequency transmissions. The first wiring substrate includes a first copper layer and a first conductive wiring layer. A waterproof layer is formed on exposed surfaces of the first wiring substrate. A second wiring substrate suitable for low-frequency transmissions defines a receiving groove. The second wiring substrate includes a second copper layer and defines a first blind hole. The first wiring substrate is pressed in the receiving groove. A first conductive portion is formed in the first blind hole to electrically connect the first conductive wiring layer and the second copper layer.