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New Taipei, Taiwan

Garuda Technology Co., Ltd.

USPTO Granted Patents = 47

Forward Citations = 28

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55 inventors (with patents filed for the assignee):

Ming-Jaan Ho (8 out of 68 patents)

Yong-Chao Wei (8 out of 20 patents)

Xian-Qin Hu (7 out of 39 patents)

4. Biao Li (5 out of 21 patents)

5. Wei-Liang Wu (4 out of 5 patents)

6. Mao-Feng Hsu (4 out of 12 patents)

7. Yan-Lu Li (4 out of 17 patents)

8. Zhi-Hong Yang (4 out of 4 patents)

9. Xiao-Juan Zhang (4 out of 4 patents)

10. Hao-Wen Zhong (3 out of 9 patents)

11. Jia-He Li (3 out of 6 patents)

12. Ying Wang (3 out of 26 patents)

13. Ning Hou (2 out of 17 patents)

14. Fu-Yun Shen (2 out of 37 patents)

15. Cong Lei (2 out of 5 patents)

Core Competencies:

Circuit Board

Flexible Circuit Board

Embedded Components

Heat Dissipation

Wiring Substrate

Buried Thermistor

Photoelectric Composite

Board-to-Board Connection

Ultrathin Structure

Manufacturing Method

Thermocouple

Printed Circuit Board

47 patents: Sort by Forward Citations

1. 12727091 - Circuit board assembly and method of manufacturing the same, packaging structure having the same (2026-09-01),

2. 12520436 - Circuit board assembly and manufacturing method thereof (2026-01-06),

3. 12513821 - Flexible circuit board and method of fabricating the same (2025-12-30),

4. 12513817 - Circuit board and manufacturing method thereof (2025-12-30),

5. 12439520 - Circuit board with embedded resistors and method for fabricating the same (2025-10-07),

6. 12408267 - Method for manufacturing a circuit board with one embedded electronic component (2025-09-02),

7. 12396088 - Circuit board assembly and method for manufacturing the same (2025-08-19),

8. 12382579 - Stretchable circuit board assembly and method for manufacturing the same (2025-08-05),

9. 12245358 - Circuit board with embedded electronic component and manufacturing method thereof (2025-03-04),

10. 12238852 - Circuit board and method for manufacturing the same (2025-02-25),

11. 12191056 - Buried thermistor and method of fabricating the same (2025-01-07),

12. 12153252 - Method for manufacturing photoelectric composite circuit board (2024-11-26),

13. 12120812 - Circuit board and method of manufacturing thereof (2024-10-15),

14. 12108533 - Circuit board and method for manufacturing thereof (2024-10-01),

15. 12101871 - Circuit board using thermocouple to dissipate generated heat and method for manufacturing the same (2024-09-24),

Company Overview

Garuda Technology Co., Ltd., based in New Taipei, Taiwan, specializes in advanced circuit board technologies. The company focuses on the development and manufacturing of innovative solutions such as embedded resistors, stretchable circuit boards, and photoelectric composite circuit boards. Their expertise extends to flexible printed circuit boards and heat dissipation devices, catering to a variety of industries that require high-performance electronic components. Garuda Technology is committed to enhancing the functionality and reliability of electronic systems through its cutting-edge technologies.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

47 Patents

#71 in New Taipei

#421 in Taiwan

#14,821 in the World

New Taipei, Taiwan

Garuda Technology Co., Ltd.

Forward Citations = 28

55 inventors:

Ming-Jaan Ho (8 out of 68 patents)

Yong-Chao Wei (8 out of 20 patents)

Xian-Qin Hu (7 out of 39 patents)

4. Biao Li (5 out of 21 patents)

5. Wei-Liang Wu (4 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Garuda Technology Co., Ltd.. Retrieved from https://idiyas.com/company/garuda-technology-company

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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