The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2025

Filed:

Aug. 30, 2023
Applicants:

Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Hebei Province, CN;

Avary Holding (Shenzhen) Co., Ltd., Shenzhen, CN;

Garuda Technology Co., Ltd., New Taipei, TW;

Inventors:

Xiao-Juan Zhang, Hebei Province, CN;

Gang Yuan, Hebei Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/167 (2013.01); H05K 3/423 (2013.01); H05K 2201/09509 (2013.01); H05K 2203/128 (2013.01);
Abstract

A circuit board with embedded resistors and a method for fabricating the same are provided. The circuit board includes the circuit substrate and the variable resistor region. The variable resistor region includes the first resistor layer, the second resistor layer and the liquid metal material. The first resistor layer is electrically connected to the circuit substrate, and the second resistor layer overlaps the first resistor layer. The liquid metal material is located on and is electrically connected to the first resistor layer. The liquid metal material is spaced from the second resistor layer without any electrical connection under the initial temperature. The liquid metal material is electrically connected to the second resistor layer under the first temperature which is higher than the initial temperature.


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