The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 04, 2025
Filed:
Mar. 23, 2023
Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Garuda Technology Co., Ltd., New Taipei, TW;
Ying Wang, Shenzhen, CN;
Yong-Quan Yang, Qinhuangdao, CN;
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
GARUDA TECHNOLOGY CO., LTD., New Taipei, TW;
Abstract
A circuit board includes a circuit substrate. The circuit substrate includes an insulating substrate and an electronic component embedded therein. The insulating substrate defines two first slots. A first phase change material fills in the two first slots and thermally connects to the electronic component. A first wiring layer is formed on a surface of the insulating substrate, the first wiring layer covers the two first slots and thermally connects to the first phase change material. A second wiring layer is formed on another surface of the insulating substrate. The second wiring layer includes a plurality of wiring portions and a wiring slot formed between adjacent wiring portions. The electronic component electrically connects to the second wiring portion. A second phase change material fills in at least one wiring slot and thermally connects a portion of the wiring portions together to form a heat dissipation zone.