The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2025
Filed:
Aug. 28, 2023
Avary Holding (Shenzhen) Co., Ltd., Shenzhen, CN;
Qingding Precision Electronics (Huai'an) Co., Ltd., Jiangsu Province, CN;
Garuda Technology Co., Ltd., New Taipei, TW;
Hao-Wen Zhong, Shenzhen, CN;
Fang-Bo Xu, Shenzhen, CN;
QINGDING PRECISION ELECTRONICS (HUAI'AN) CO., LTD., Jiangsu Province, CN;
GARUDA TECHNOLOGY CO., LTD., New Taipei, TW;
Abstract
A circuit board includes a first multilayered structure, a second multilayered structure, a third multilayered structure, a first adhesive layer, a second adhesive layer and a plurality of hollow portions. The first adhesive layer is disposed between the first multilayered structure and the second multilayered structure. The second adhesive layer is disposed between the second multilayered structure and the third multilayered structure, wherein the second multilayered structure is arranged between the first adhesive layer and the second adhesive layer. The plurality of hollow portions are formed on at least one of the first multilayered structure, the second multilayered structure and the third multilayered structure. When the circuit board is bent, a force is applied on the plurality of hollow portions to make the plurality of hollow portions deform and change a cross-sectional area of each of the plurality of hollow portions.