The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 26, 2024
Filed:
Jul. 31, 2023
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;
Garuda Technology Co., Ltd., New Taipei, TW;
Wei-Liang Wu, Shenzhen, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an, CN;
GARUDA TECHNOLOGY CO., LTD., New Taipei, TW;
Abstract
A method for manufacturing a photoelectric composite circuit board, includes providing a copper-clad carrier and an intermediate circuit, the copper-clad carrier includes a substrate layer and a bottom copper layer, a first groove is defined on the intermediate circuit. Forming an optical fiber in the first groove. Forming a first accommodating groove and a second accommodating groove at each end the optical fiber. Accommodating a first coupling element in the first accommodating groove. Removing the substrate layer. Removing the bottom copper layer corresponding to the optical fiber, the intermediate circuit on one side of the optical fiber and the bottom copper layer forming a first circuit substrate, the intermediate circuit on another side of the optical fiber and the bottom copper layer forming a second circuit substrate. Electrically connecting a chip to the first circuit substrate, and electrically connecting an electronic component to the second circuit substrate.