Cong Lei

Title: Cong Lei: Innovator in Heat Dissipation Technologies

Introduction

Cong Lei is a prominent inventor based in Huaian, China, known for his contributions to heat dissipation technologies. With a total of five patents to his name, he has made significant advancements in the design and manufacturing of heat dissipation structures for electronic devices. His innovative approaches have garnered attention in the field of electronics.

Latest Patents

Cong Lei's latest patents include a "Method for Making a Heat Dissipation Structure" and a "Method for Manufacturing an Ultrathin Heat Dissipation Structure." The first patent describes an electronic device that features a heat dissipation structure comprising a flexible substrate, a graphite sheet, and a heat insulating material. This design includes a sealed cavity filled with a phase-changing material, enhancing the efficiency of heat management in electronic devices. The second patent outlines a method for creating an ultrathin heat dissipation structure using a copper clad sheet, which involves stamping to form grooves and ribs, infilling phase-change material, and sealing the structure with a cover.

Career Highlights

Throughout his career, Cong Lei has worked with notable companies such as Avary Holding (Shenzhen) Co., Limited and Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd. His experience in these organizations has contributed to his expertise in developing advanced heat dissipation solutions.

Collaborations

Cong Lei has collaborated with talented individuals in the field, including Ming-Jaan Ho and Fu-Yun Shen. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Cong Lei's work in heat dissipation technologies showcases his commitment to advancing electronic device efficiency. His patents reflect a deep understanding of materials and design, positioning him as a key figure in the industry.