logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10745595 B1

PDFFull Text
Date of Patent:
Aug. 18, 2020

Filed:

Jun. 28, 2018

Resin composition, adhesive layer, and circuit board utilizing same

Applicants:

Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Fu-Yun Shen, Huai an, CN;

Cong Lei, Huai an, CN;

Ming-Jaan Ho, New Taipei, TW;

Hsiao-Ting Hsu, New Taipei, TW;

Assignees:

QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

William K Cheung

Int. Cl.
CPC ...
C09J 109/06 (2006.01); C08K 3/28 (2006.01); C08K 3/36 (2006.01); C08F 210/02 (2006.01); C08F 212/08 (2006.01); C08F 236/06 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C09J 109/06 (2013.01); C08K 3/28 (2013.01); C08K 3/36 (2013.01); C08K 5/0066 (2013.01); C08F 210/02 (2013.01); C08F 212/08 (2013.01); C08F 236/06 (2013.01); C08F 2800/20 (2013.01); C08K 2003/285 (2013.01);
Abstract

A resin having thermal conductivity comprises a styrene-butadiene-styrene block copolymer in 35 to 85 parts by weight, a styrene-ethylene-butene-styrene block copolymer in 5 to 65 parts by weight, a polyphenylene ether in 3 to 35 parts by weight; and a dendritic acrylate oligomer in 3 to 45 parts by weight. An adhesive layer and a circuit board using the resin composition are also described.

Find Patent Forward Citations

Shen, Fu-Yun. (2020). Resin composition, adhesive layer, and circuit board utilizing same (U.S. Patent No. 10745595). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10745595

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…