The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2019
Filed:
Jun. 24, 2016
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;
Garuda Technology Co., Ltd., New Taipei, TW;
Ning Hou, Shenzhen, CN;
Cong Lei, Shenzhen, CN;
Biao Li, Shenzhen, CN;
Ming-Jaan Ho, New Taipei, TW;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Qinhuangdao, CN;
GARUDA TECHNOLOGY CO., LTD., New Taipei, TW;
Abstract
An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.