The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Nov. 30, 2020
Applicant:

Zhen Ding Technology Co., Ltd., Taoyuan, TW;

Inventors:

Wei-Hsin Huang, Taoyuan, TW;

Chi-Fei Huang, Taoyuan, TW;

Szu-Hsiang Su, Taoyuan, TW;

Shou-Jui Hsiang, Tayuan, TW;

Kuan-Wei Lee, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/28 (2006.01); B29C 53/56 (2006.01); B32B 37/02 (2006.01); B29C 53/00 (2006.01); B29C 53/16 (2006.01); B32B 38/10 (2006.01); B32B 38/00 (2006.01); B32B 37/20 (2006.01); B29K 105/00 (2006.01); C08G 73/10 (2006.01); B29K 79/00 (2006.01); C08G 69/32 (2006.01);
U.S. Cl.
CPC ...
B32B 27/281 (2013.01); B29C 53/005 (2013.01); B29C 53/16 (2013.01); B29C 53/56 (2013.01); B32B 37/02 (2013.01); B32B 37/203 (2013.01); B32B 38/0036 (2013.01); B32B 38/10 (2013.01); B29K 2079/08 (2013.01); B29K 2105/256 (2013.01); B32B 2038/0028 (2013.01); B32B 2038/0076 (2013.01); B32B 2250/04 (2013.01); B32B 2250/24 (2013.01); B32B 2255/26 (2013.01); B32B 2309/02 (2013.01); B32B 2309/04 (2013.01); B32B 2379/08 (2013.01); C08G 69/32 (2013.01); C08G 73/1028 (2013.01);
Abstract

A method for manufacturing a thick polyimide film includes providing a first and second laminated structures. The first and second laminated structures are heated, and the heated first and second laminated structures are wound together to form a third laminated structure. The first polyamic acid gel film of the heated first laminated structure and the second polyamic acid gel film of the heated second laminated structure are overlapped and bonded together to form a third polyamic acid gel film. Two third laminated structures are wound together to form a fourth polyamic acid gel film. A dehydration ring-closure imidization reaction is applied to the fourth polyamic acid gel film by heating to obtain the thick polyimide film. A thick polyimide film manufactured by the method is also disclosed.


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