The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Jan. 15, 2018
Applicant:

Zhen Ding Technology Co., Ltd., Taoyuan, TW;

Inventors:

Szu-Hsiang Su, Taoyuan, TW;

Shou-Jui Hsiang, Taoyuan, TW;

Mao-Feng Hsu, Taoyuan, TW;

Ming-Jaan Ho, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08L 51/08 (2006.01); C08L 51/00 (2006.01); C08J 3/24 (2006.01); H05K 1/03 (2006.01); C08J 5/18 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08J 3/246 (2013.01); C08J 5/18 (2013.01); C08L 51/003 (2013.01); C08L 51/006 (2013.01); C08L 51/08 (2013.01); H05K 1/0373 (2013.01); C08J 2351/00 (2013.01); C08J 2351/04 (2013.01); C08J 2351/06 (2013.01); C08J 2351/08 (2013.01); C08J 2379/08 (2013.01); C08J 2447/00 (2013.01); C08J 2463/00 (2013.01); C08J 2471/12 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01); C08L 2312/00 (2013.01); H05K 3/386 (2013.01); H05K 2201/0104 (2013.01); H05K 2201/0154 (2013.01);
Abstract

A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.


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