The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Aug. 30, 2017
Applicant:

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Inventors:

Chen-Feng Yen, Taoyuan, TW;

Chang-Hung Lee, Taoyuan, TW;

Yi-Fang Lin, Taoyuan, TW;

Yen-Chin Hsiao, Taoyuan, TW;

Shou-Jui Hsiang, Taoyuan, TW;

Mao-Feng Hsu, Taoyuan, TW;

Assignee:

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/029 (2006.01); H05K 1/03 (2006.01); C09D 139/04 (2006.01); C07D 263/12 (2006.01); C07D 263/14 (2006.01); C09D 133/06 (2006.01); G03F 7/031 (2006.01); G03F 7/038 (2006.01); G03F 7/07 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
G03F 7/029 (2013.01); C07D 263/12 (2013.01); C07D 263/14 (2013.01); C09D 133/062 (2013.01); C09D 139/04 (2013.01); G03F 7/031 (2013.01); G03F 7/0388 (2013.01); G03F 7/07 (2013.01); H05K 1/0353 (2013.01); H05K 3/287 (2013.01); H05K 3/3452 (2013.01);
Abstract

A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.


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