Taoyuan, Taiwan

Shing-Tza Liou


Average Co-Inventor Count = 2.8

ph-index = 2

Forward Citations = 12(Granted Patents)


Location History:

  • Tayuan, TW (2012)
  • Taoyuan, TW (2009 - 2013)

Company Filing History:


Years Active: 2009-2013

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9 patents (USPTO):Explore Patents

Title: Shing-Tza Liou: Innovator in Flexible Printed Circuit Boards

Introduction

Shing-Tza Liou, an accomplished inventor located in Taoyuan, Taiwan, has made significant contributions to the field of electronics through his innovations in flexible printed circuit boards (FPCBs) and printed circuit boards (PCBs). With a total of 9 patents, his work reflects a commitment to enhancing the manufacturing processes and functionality of electronic components.

Latest Patents

Among Shing-Tza Liou's latest innovations are two notable patents. The first, titled "Method of Manufacturing FPCB Substrate," outlines a technique that includes several steps to produce a high-quality FPCB substrate. The method begins with the provision of an FPCB material that comprises an insulation layer and an electrically conductive layer. A critical feature of this patent is the creation of a through hole that connects the layers, allowing for unique electrical functionalities through the formation of a hook that enhances connectivity.

The second patent, “Method for Manufacturing a Printed Circuit Board,” describes an exemplary process for creating printed circuit boards. This innovative method involves forming numerous through holes in a substrate and applying an electrically conductive paste to fill these holes. This process not only results in filling members but also establishes electrical traces on the substrate, ensuring a robust and efficient manufacturing process.

Career Highlights

Shing-Tza Liou's career includes pivotal roles at leading companies in the electronics industry. He has made significant contributions while working at Fukui Precision Component (Shenzhen) Co., Ltd., and Zhen Ding Technology Co., Ltd. His experience at these companies has equipped him with the knowledge and skills necessary to spearhead innovative manufacturing methods in the competitive electronics market.

Collaborations

Throughout his career, Shing-Tza Liou has collaborated with esteemed colleagues, including Yung-Wei Lai and Yao-Wen Bai. These partnerships have fostered a creative environment that has led to the development of groundbreaking inventions, demonstrating the importance of teamwork in the realm of innovation.

Conclusion

In conclusion, Shing-Tza Liou stands out as a significant inventor in the field of flexible printed circuit boards and printed circuit boards. His innovative patents and collaborations with industry professionals showcase a dedication to advancing technology in electronics manufacturing. As the industry evolves, Liou’s contributions will undoubtedly continue to impact the future of electronic designs and applications.

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