The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2012

Filed:

Jun. 09, 2008
Applicants:

Qi Zhang, Shenzhen, CN;

Yung-wei Lai, Tayuan, TW;

Shing-tza Liou, Tayuan, TW;

Inventors:

Qi Zhang, Shenzhen, CN;

Yung-Wei Lai, Tayuan, TW;

Shing-Tza Liou, Tayuan, TW;

Assignees:

FuKui Precision Component (Shenzhen) Co., Ltd., Shenzhen, Guangdong Province, CN;

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured.


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