Yung-Wei Lai

Title: Yung-Wei Lai: Innovator in Flexible Printed Circuit Board Technology

Introduction

Yung-Wei Lai is a prominent inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of flexible printed circuit boards (FPCBs) and printed circuit boards (PCBs). With a total of four patents to his name, Lai's work has advanced the manufacturing processes in this critical area of electronics.

Latest Patents

Lai's latest patents include a method of manufacturing FPCB substrates and a method for manufacturing printed circuit boards. The method for manufacturing FPCB substrates involves several steps, including providing a FPCB material with an insulation layer and an electrically conductive layer. A through hole is formed, which includes a metal hole in the conductive layer and an insulation hole in the insulation layer. The insulation hole is then enlarged to expose a portion of the conductive layer, which is bent to form a hook that protrudes from the insulation layer. His method for manufacturing printed circuit boards includes providing a substrate, forming through holes, and applying electrically conductive paste to create filling members and electrical traces, which are then cured.

Career Highlights

Throughout his career, Yung-Wei Lai has worked with notable companies such as Fukui Precision Component (Shenzhen) Co., Ltd. and Zhen Ding Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in the electronics industry.

Collaborations

Lai has collaborated with several professionals in his field, including Shing-Tza Liou and Yun-Li Zhu. These collaborations have likely enhanced his work and led to further advancements in PCB technology.

Conclusion

Yung-Wei Lai is a distinguished inventor whose work in flexible printed circuit board technology has made a lasting impact on the industry. His innovative methods and collaborations continue to shape the future of electronics manufacturing.