The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2011
Filed:
Jun. 30, 2008
Shing-tza Liou, Taoyuan, TW;
Yao-wen Bai, Shenzhen, CN;
Rui Zhang, Shenzhen, CN;
Qiu-yue Zhang, Shenzhen, CN;
Shing-Tza Liou, Taoyuan, TW;
Yao-Wen Bai, Shenzhen, CN;
Rui Zhang, Shenzhen, CN;
Qiu-Yue Zhang, Shenzhen, CN;
FuKui Precision Component (Shenzhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Advanced Technology Inc., Tayuan, Taoyuan, TW;
Abstract
An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.