The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2020

Filed:

Aug. 07, 2019
Applicant:

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Inventors:

Ming-Jaan Ho, Taoyuan, TW;

Mao-Feng Hsu, Taoyuan, TW;

Shou-Jui Hsiang, Taoyuan, TW;

Nan-Kun Huang, Taoyuan, TW;

Yu-Wen Kao, Taoyuan, TW;

Chia-Yin Teng, Taoyuan, TW;

Ching-Hsuan Lin, Taoyuan, TW;

Assignee:

Zhen Ding Technology Co., Ltd., Tayuan, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 179/08 (2006.01); C08L 63/00 (2006.01); C08G 73/10 (2006.01);
U.S. Cl.
CPC ...
C09D 179/08 (2013.01); C08G 73/101 (2013.01); C08G 73/1028 (2013.01); C08G 73/1032 (2013.01); C08G 73/1039 (2013.01); C08G 73/1053 (2013.01); C08G 73/1064 (2013.01); C08G 73/1067 (2013.01); C08G 73/1071 (2013.01); C08L 63/00 (2013.01); C08L 2203/202 (2013.01);
Abstract

A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar' represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula of hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.


Find Patent Forward Citations

Loading…