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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10844174 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

Oct. 30, 2017

Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same

Applicant:

Zhen Ding Technology Co., Ltd., Taoyuan, TW;

Inventors:

Nan-Kun Huang, Taoyuan, TW;

Shou-Jui Hsiang, Taoyuan, TW;

Yu-Wen Kao, Taoyuan, TW;

Szu-Hsiang Su, Taoyuan, TW;

Assignee:

Zhen Ding Technology Co., Ltd., Taoyuan, TW;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

John D Freeman

Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 15/20 (2006.01); C08G 73/10 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1078 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); H05K 1/036 (2013.01); H05K 3/022 (2013.01); H05K 3/386 (2013.01); B32B 2307/204 (2013.01); B32B 2457/08 (2013.01); H05K 1/0346 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0195 (2013.01);
Abstract

A low dielectric polyimide composition comprises an aliphatic anhydride, a long chain diamine, and an ester diamine. A polyimide made of such low dielectric polyimide composition has low polarizability group, thus the dielectric constant of the polyimide is lower. A polyimide made of the low dielectric polyimide composition, a polyimide film using the polyimide, and a copper clad laminate using the polyimide film are also provided.

Find Patent Forward Citations

Huang, Nan-Kun. (2020). Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same (U.S. Patent No. 10844174). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10844174

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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