The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Oct. 18, 2017
Package substrate and associated fabrication method with varying depths for circuit device terminals
Phoenix & Corporation, Grand Cayman, KY;
Chu-Chin Hu, Hsinchu County, TW;
Shih-Ping Hsu, Hsinchu County, TW;
PHOENIX & CORPORATION, Grand Cayman, KY;
Abstract
This disclosure provides a package substrate and its fabrication method. The package substrate includes: a molding compound body; a first circuit device disposed in the molding compound body, the first circuit device having a first terminal at a top of the first circuit device; a first conductive via formed in the molding compound body and connected to the first terminal; a second circuit device disposed in the molding compound body, the second circuit device having a second terminal at a top of the second circuit device; a second conductive via formed in the molding compound body and connected to the second terminal; and a redistribution layer with a conductive wire formed on the molding compound body, the conductive wire connecting the first conductive via and the second conductive via; wherein the first and second terminals are respectively located at different depths of the molding compound body.