The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2019
Filed:
Jan. 08, 2016
Applicant:
Phoenix Pioneer Technology Co., Ltd., Hsinchu County, TW;
Inventors:
Chu-Chin Hu, Hsinchu County, TW;
Shih-Ping Hsu, Hsinchu County, TW;
Assignee:
PHOENIX PIONEER TECHNOLOGY CO., LTD., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01); H01L 31/00 (2006.01); G06K 9/00 (2006.01); H05K 7/00 (2006.01); H01L 23/02 (2006.01); H01L 31/054 (2014.01); H05K 3/28 (2006.01); H01L 31/0232 (2014.01); A61B 5/1172 (2016.01); H01L 23/498 (2006.01); A61B 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); G06K 9/0004 (2013.01); H01L 31/00 (2013.01); H05K 1/185 (2013.01); A61B 5/0077 (2013.01); A61B 5/1172 (2013.01); H01L 23/49861 (2013.01); H01L 31/0232 (2013.01); H01L 31/054 (2014.12); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/181 (2013.01); H05K 3/284 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01);
Abstract
An electronic package is provided, which includes: an insulator; an electronic element embedded in the insulator and having a sensing area exposed from the insulator; and a conductive structure disposed on the insulator and electrically connected to the electronic element, thereby reducing the thickness of the overall structure.