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Hsinchu, Taiwan

Phoenix Precision Technology Corporation

USPTO Granted Patents = 95

Forward Citations = 1,360

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49 inventors (with patents filed for the assignee):

Shih-Ping Hsu (57 out of 164 patents)

Chao-Wen Shih (7 out of 130 patents)

Wen-Hung Hu (7 out of 11 patents)

4. Kan-Jung Chia (7 out of 17 patents)

5. Chung-Cheng Lien (6 out of 8 patents)

6. Lin-Yin Wong (6 out of 8 patents)

7. Ying-Tung Wang (6 out of 6 patents)

8. Chu-Chin Hu (5 out of 22 patents)

9. Sao-Hsia Tang (5 out of 5 patents)

10. I-Chung Tung (5 out of 6 patents)

11. Chia-Wei Chang (4 out of 46 patents)

12. Kun-Chen Tsai (4 out of 8 patents)

13. Zao-Kuo Lai (4 out of 5 patents)

14. Bo-Wei Chen (3 out of 15 patents)

15. Shang-Wei Chen (3 out of 15 patents)

Core Competencies:

Coreless Substrate

Semiconductor Chip

Embedded Electronic Components

Circuit Board Structure

Conductive Bump Structure

Heat-Dissipating Structure

Optoelectronic Component

Multi-Layer Circuit Board

Electrical Connector Structure

Chip Embedded Packaging

Thermally Enhanced Semiconductor Device

Direct Electrical Connections

95 patents: Sort by Forward Citations

1. 8058723 - Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof (2011-11-15),

2. 7768119 - Carrier structure embedded with semiconductor chip (2010-08-03),

3. 7763969 - Structure with semiconductor chips embeded therein (2010-07-27),

4. 7754598 - Method for manufacturing coreless packaging substrate (2010-07-13),

5. 7754538 - Packaging substrate structure with electronic components embedded therein and method for manufacturing the same (2010-07-13),

6. 7719853 - Electrically connecting terminal structure of circuit board and manufacturing method thereof (2010-05-18),

7. 7719104 - Circuit board structure with embedded semiconductor chip and method for fabricating the same (2010-05-18),

8. 7718470 - Package substrate and method for fabricating the same (2010-05-18),

9. 7706148 - Stack structure of circuit boards embedded with semiconductor chips (2010-04-27),

10. 7705471 - Conductive bump structure of circuit board and method for forming the same (2010-04-27),

11. 7705456 - Semiconductor package substrate (2010-04-27),

12. 7705446 - Package structure having semiconductor chip embedded therein and method for fabricating the same (2010-04-27),

13. 7674986 - Circuit board structure having capacitor array and embedded electronic component and method for fabricating the same (2010-03-09),

14. 7674362 - Method for fabrication of a conductive bump structure of a circuit board (2010-03-09),

15. 7659193 - Conductive structures for electrically conductive pads of circuit board and fabrication method thereof (2010-02-09),

Phoenix Precision Technology Corporation is a leading global provider of precision machining solutions. With cutting-edge facilities and a highly skilled team, we offer comprehensive manufacturing services for various industries, including aerospace, automotive, medical, and telecommunications. Our commitment to quality, innovation, and customer satisfaction has made us a trusted partner for clients worldwide. Visit our website to explore our capabilities and learn more about how we can meet your precision machining needs.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

95 Patents

#42 in Hsinchu

#244 in Taiwan

#7,880 in the World

Hsinchu, Taiwan

Phoenix Precision Technology Corporation

Forward Citations = 1,360

49 inventors:

Shih-Ping Hsu (57 out of 164 patents)

Chao-Wen Shih (7 out of 130 patents)

Wen-Hung Hu (7 out of 11 patents)

4. Kan-Jung Chia (7 out of 17 patents)

5. Chung-Cheng Lien (6 out of 8 patents)

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