The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 27, 2010

Filed:

Oct. 27, 2006
Applicants:

Shih Ping Hsu, Hsin-chu, TW;

Chung Cheng Lien, Hsin-chu, TW;

Chia Wei Chang, Hsin-chu, TW;

Inventors:

Shih Ping Hsu, Hsin-chu, TW;

Chung Cheng Lien, Hsin-chu, TW;

Chia Wei Chang, Hsin-chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A stack structure of circuit boards embedded with semiconductor chips is proposed. At least two circuit boards are provided. Each of the circuit boards includes circuit layers formed on surfaces thereof and at least one opening embedded with a semiconductor chip, wherein, the circuit layers have a plurality of conductive structures and electrically conductive pads, and the semiconductor chip has a plurality of electrode pads, and the conductive structures of the circuit layers are electrically conductive to the electrode pads of the semiconductor chip. At least one adhesive layer is formed between the two circuit boards and disposed with a conductive material corresponding in position to the electrically conductive pads of the circuit boards. Thus, a conductive path can be formed by the conductive material between the electrically conductive pads of the circuit boards, thereby establishing electrical connection between the two circuit boards.


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