This inventor holds 3 USPTO granted patents. Top assignees: Unimicron Technology Corporation, Phoenix Precision Technology Corporation. Active years: 2010-2011.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Hsin-chu, TW (2010 - 2011)
- Taoyuan, TW (2011)
Company Filing History:
2 out of 522 
1 out of 95 Years Active: 2010-2011
Title: Shih Ping Hsu: Innovator in Semiconductor Packaging
Introduction
Shih Ping Hsu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His innovative designs focus on enhancing electrical performance and efficiency in semiconductor applications.
Latest Patents
One of his latest patents is a package structure that includes a semiconductor chip disposed in a core board. This design features a first surface and an opposite second surface, with a plurality of first and second electrode pads on the active and inactive surfaces of the semiconductor chip. The semiconductor chip is equipped with through-silicon vias, allowing for electrical connections to both sides of the package structure. This innovation enhances electrical quality and increases wiring layout density, thereby improving overall electrical performance.
Another significant patent is a circuit board structure embedded with semiconductor chips. In this design, a semiconductor chip is housed in a cavity of a supporting board, with a dielectric layer and a circuit layer formed on both the supporting board and the chip. The inclusion of hollow conductive vias in the dielectric layer ensures effective electrical connections while preventing issues related to different coefficients of expansion and thermal stress.
Career Highlights
Shih Ping Hsu has worked with prominent companies in the semiconductor industry, including Unimicron Technology Corporation and Phoenix Precision Technology Corporation. His experience in these organizations has contributed to his expertise in semiconductor packaging technologies.
Collaborations
Some of his notable coworkers include Chung Cheng Lien and Shang Wei Chen, who have collaborated with him on various projects in the semiconductor field.
Conclusion
Shih Ping Hsu's innovative work in semiconductor packaging has led to advancements that enhance electrical performance and efficiency. His contributions are significant in the ongoing development of semiconductor technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile