The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2011

Filed:

Apr. 21, 2009
Applicants:

Shih Ping Hsu, Hsin-chu, TW;

Chung Cheng Lien, Hsin-Chu, TW;

Shang Wei Chen, Hsin-Chu, TW;

Inventors:

Shih Ping Hsu, Hsin-chu, TW;

Chung Cheng Lien, Hsin-Chu, TW;

Shang Wei Chen, Hsin-Chu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/053 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board structure embedded with semiconductor chips is proposed. A semiconductor chip is received in a cavity of a supporting board. A dielectric layer and a circuit layer are formed on the supporting board and the semiconductor chip. A plurality of hollow conductive vias are formed in the dielectric layer for electrically connecting the circuit layer to the semiconductor chip. By providing the hollow conductive vias of present invention, the separating results of different coefficients of expansion and thermal stress are prevented, and thus electrical function of products is ensured.


Find Patent Forward Citations

Hsu, Shih. (2011). Circuit board structure embedded with semiconductor chips (U.S. Patent No. 7863729). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7863729

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…